Effect of Geometry on Void Formation in Commercial Electroplating of Thin Strips to Copper
Surface and Coatings Technology, 202:17, 4153-4158, 2008, doi: 10.1016/j.surfcoat.2008.03.004
2008
Cite this publication
Okelman, M. K., B. G. Thomas, and M. Powers, "Effect of Geometry on Void Formation in Commercial Electroplating of Thin Strips to Copper", Surface and Coatings Technology, 202:17, 4153-4158, 2008, doi: 10.1016/j.surfcoat.2008.03.004 (2008).